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1. general description the ntsx2102 is a 2-bit, dual supply translat ing transceiver with auto direction sensing, that enables bidirectional voltage level translation. it features two 2-bit input-output ports (an and bn), one output enable input (oe) and two supply pins (v cc(a) and v cc(b) ). both supplies can be supplied at any voltage between 1.65 v and 5. 5 v. this flexibility makes the device suitable for translating between any of the voltage nodes (1.8 v, 2.5 v, 3.3 v and 5.0 v). pins an and oe are referenced to v cc(a) and pins bn are referenced to v cc(b) . a low level at pin oe causes the outputs to assume a high-impedance off-state. this device is fully specified for partia l power-down app lications using i off . the i off circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. features and benefits ? wide supply voltage range: ? v cc(a) : 1.65 v to 5.5 v and v cc(b) : 1.65 v to 5.5 v ? maximum data rates: ? 50 mbps ? i off circuitry provides partial power-down mode operation ? inputs accept voltages up to 5.5 v ? esd protection: ? hbm js-001 class 2 exceeds 2000 v ? cdm jesd22-c101e exceeds 2000 v ? latch-up performance exceeds 100 ma per jesd 78b class ii ? multiple package options ? specified from ? 40 ? cto+85 ? c 3. applications ? i 2 c/smbus ? uart ? gpio ntsx2102 dual supply translating tr ansceiver; open drain; auto direction sensing rev. 2 ? 11 february 2013 product data sheet
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 2 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 4. ordering information 5. marking 6. functional diagram table 1. ordering information type number package temperature range name description version NTSX2102GM ? 40 ? c to +85 ? c xqfn8 plastic extremely thin quad flat package; no leads; 8 terminals; body 1.6 ? 1.6 ? 0.5 mm sot902-2 ntsx2102gu8 ? 40 ? c to +85 ? c xqfn8 xqfn8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.4 ? 1.2 ? 0.5 mm sot1309-1 ntsx2102gd ? 40 ? c to +85 ? c xson8 plastic extremely thin small outline package; no leads; 8 terminals; body 3 ? 2 ? 0.5 mm sot996-2 table 2. marking type number marking code NTSX2102GM sx2 ntsx2102gu8 sx ntsx2102gd sx2 fig 1. logic symbol
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 3 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 7. pinning information 7.1 pinning 7.2 pin description fig 2. pin configuration sot902-2 (xqfn8) fig 3. pin configuration sot1309-1 (xqfn8)
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fig 4. pin configuration sot996-2 (xson8) !
table 3. pin description symbol pin description b2, b1 6, 7 data input or output (referenced to v cc(b) ) gnd 4 ground (0 v) v cc(a) 1 supply voltage a a2, a1 3, 2 data input or output (referenced to v cc(a) ) oe 5 output enable input (active high; referenced to v cc(a) ) v cc(b) 8 supply voltage b
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 4 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 8. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; z = high-impedance off-state. [2] when either v cc(a) or v cc(b) is at gnd level, the device goes into power-down mode. 9. limiting values [1] the minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed. [2] v cco is the supply voltage associated with the output. 10. recommended operating conditions table 4. function table [1] supply voltage input input/output v cc(a) v cc(b) oe an bn 1.65 v to 5.5 v 1.65 v to 5.5 v l z z 1.65 v to 5.5 v 1.65 v to 5.5 v h input or output output or input gnd [2] gnd [2] xzz table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc(a) supply voltage a ? 0.5 +6.5 v v cc(b) supply voltage b ? 0.5 +6.5 v v i input voltage a port and oe input [1] [2] ? 0.5 +6.5 v b port [1] [2] ? 0.5 +6.5 v v o output voltage active mode [1] [2] a or b port ? 0.5 v cco +0.5 v power-down or 3-state mode [1] a or b port ? 0.5 +6.5 v i ik input clamping current v i <0v ? 50 - ma i ok output clamping current v o <0v ? 50 - ma i o output current v o =0vtov cco [2] - ? 50 ma i cc supply current i cc(a) or i cc(b) -1 0 0m a i gnd ground current ? 100 - ma t stg storage temperature ? 65 +150 ?c p tot total power dissipation t amb = ? 40 ? c to +85 ? c-2 5 0m w table 6. recommended operating conditions [1] symbol parameter conditions min max unit v cc(a) supply voltage a 1.65 5.5 v v cc(b) supply voltage b 1.65 5.5 v
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 5 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing [1] hold the a and b sides of an unused i/o pair in the same state, both at v cci or both at gnd. 11. static characteristics [1] v cco is the supply voltage associated with the output. t amb ambient temperature ? 40 +85 ?c ? t/ ? v input transition rise and fall rate a, b or oe port v cc(a) = 1.65 v to 5.5 v; v cc(b) =1.65v to 5.5v - 10 ns/v table 6. recommended operating conditions [1] ?continued symbol parameter conditions min max unit table 7. typical static characteristics at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v); t amb = 25 ? c. symbol parameter conditions min typ max unit c i input capacitance oe input; v cc(a) = v cc(b) =0v - 2.2 - pf c i/o input/output capacitance a or b port; v cc(a) = 5.0 v; v cc(b) =5.0v - 10 - pf table 8. static characteristics at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions ? 40 ? c to +85 ?c unit min max v ih high-level input voltage a or b port v cc(a) = 1.65 v to 5.5 v; v cc(b) =1.65v to 5.5v [1] v cci ? 0.4 - v oe input v cc(a) = 1.65 v to 5.5 v; v cc(b) = 1.65 v to 5.5 v 0.65v cc(a) -v v il low-level input voltage a or b port v cc(a) = 1.65 v to 5.5 v; v cc(b) = 1.65 v to 5.5 v - 0.4 v oe input v cc(a) = 1.65 v to 5.5 v; v cc(b) = 1.65 v to 5.5 v - 0.35v cc(a) v v ol low-level output voltage a or b port; i o =6 ma [2] v i ? 0.15 v; v cc(a) =1.65vto5.5v; v cc(b) =1.65vto5.5v -0.4v i i input leakage current oe input; v i = 0 v to v cc(a) ; v cc(a) =1.65vto5.5v; v cc(b) =1.65vto5.5v - ? 1 ? a i oz off-state output current a or b port; v o =0vorv cco ; v cc(a) = 0 v to 5.5 v; v cc(b) = 0 v to 5.5 v [2] - ? 2 ? a i off power-off leakage current a port; v i or v o = 0 v to 5.5 v; v cc(a) =0v;v cc(b) =0vto5.5v - ? 2 ? a b port; v i or v o = 0 v to 5.5 v; v cc(b) =0v;v cc(a) =0vto5.5v - ? 2 ? a
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 6 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing [1] v cci is the supply voltage associated with the input. [2] v cco is the supply voltage associated with the output. 12. dynamic characteristics [1] v cco is the supply voltage associated with the output. [2] c pd is used to determine the dynamic power dissipation (p d in ? w). p d =c pd ? v cc 2 ? f i ? n+ ? (c l ? v cc 2 ? f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; ? (c l ? v cc 2 ? f o ) = sum of the outputs. [3] v cci is the supply voltage associated with the input. i cc supply current v i = 0 v or v cci ; i o = 0 a [1] i cc(a) v cc(a) = 1.65 v to 5.5 v; v cc(b) = 1.65 v to 5.5 v; oe = low or high -5 ? a v cc(a) = 1.65 v to 5.5 v; v cc(b) =0v - 2 ? a v cc(a) = 0 v; v cc(b) =1.65 vto5.5v - ? 2 ? a i cc(b) v cc(a) = 1.65 v to 5.5 v; v cc(b) = 1.65 v to 5.5 v; oe = low -5 ? a v cc(a) = 1.65 v to 5.5 v; v cc(b) =0v - ? 2 ? a v cc(a) = 0 v; v cc(b) =1.65 vto5.5v - 2 ? a table 8. static characteristics ?continued at recommended operating conditions; volt ages are referenced to gnd (ground = 0 v). symbol parameter conditions ? 40 ? c to +85 ?c unit min max table 9. typical dynamic charact eristics for temperature 25 ?c voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 ; for waveforms see figure 5 and figure 6 . symbol parameter conditions v cco [1] unit 1.8 v 2.5 v 3.3 v 5.0 v t tlh low to high output transition time a or b port 7 5 4 3 ns t thl high to low output transition time a or b port 4 6 8 11 ns c pd power dissipation capacitance oe = v cc(a) ; v cc(a) = v cc(b) ; f i = 400 khz; v i = v cci [3] [2] ---1 3 . 5p f
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 7 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing table 10. dynamic characteristics for temperature range ? 40 ? c to +85 ?c [1] voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 ; for wave forms see figure 5 and figure 6 . symbol parameter conditions v cc(b) unit 1.8 v ? 0.15 v 2.5 v ? 0.2 v 3.3 v ? 0.3 v 5.0 v ? 0.5 v typ max typ max typ max typ max v cc(a) = 1.8 v ? 0.15 v t phl high to low propagation delay a to b 3 7 3 6 3 5 5 7 ns t plh low to high propagation delay a to b 5 12 5 8 4 8 4 7 ns t phl high to low propagation delay b to a 3 7 3 6 3 5 5 7 ns t plh low to high propagation delay b to a 5 12 1 3 1 2 1 2 ns t pzl off-state to low propagation delay oe to a 9 16 9 18 10 14 10 15 ns oe to b 9 16 6 12 6 12 6 14 ns t plz low to off-state propagation delay oe to a 100 120 100 120 100 120 100 120 ns oe to b 100 120 100 120 100 120 100 120 ns t sk(o) output skew time between channels [2] -1-1-1-1ns f data data rate - 18 - 18 - 18 - 18 mbps v cc(a) = 2.5 v ? 0.2 v t phl high to low propagation delay a to b 3 6 2 5 2 5 2 5 ns t plh low to high propagation delay a to b 1 3 2 4 2.5 7 2.5 5 ns t phl high to low propagation delay b to a 3 6 2 5 2 5 2 5 ns t plh low to high propagation delay b to a 5 8 2 4 1.5 3 1 3 ns t pzl off-state to low propagation delay oe to a 6 12 5 10 8 10 5 8 ns oe to b 9 18 5 10 4.5 9 4 8 ns t plz low to off-state propagation delay oe to a 100 120 100 120 100 120 100 120 ns oe to b 100 120 100 120 100 120 100 120 ns t sk(o) output skew time between channels [2] -1-1-1-1ns f data data rate - 18 - 32 - 32 - 32 mbps v cc(a) = 3.3 v ? 0.3 v t phl high to low propagation delay a to b 3 5 2 5 2 4 2 4 ns t plh low to high propagation delay a to b 1 2 1.5 3 1.5 3 2 4 ns t phl high to low propagation delay b to a 3 5 2 5 2 4 2 4 ns t plh low to high propagation delay b to a 4 8 2.5 7 1.5 3 1 3 ns t pzl off-state to low propagation delay oe to a 6 12 4.5 9 6 9 4 7 ns oe to b 10 14 5 10 6 9 4 8 ns
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 8 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing [1] all typical values are measured at nominal v cc and t amb = 25 c. [2] skew between any two outputs of the same package switching in the same direction. 13. waveforms t plz low to off-state propagation delay oe to a 100 120 100 120 100 120 100 120 ns oe to b 100 120 100 120 100 120 100 120 ns t sk(o) output skew time between channels [2] -1-1-1-1ns f data data rate - 18 - 32 - 40 - 40 mbps v cc(a) = 5.0 v ? 0.5 v t phl high to low propagation delay a to b 5 7 2 5 2 4 2 4 ns t plh low to high propagation delay a to b 1 2 1 3 1 3 1 3 ns t phl high to low propagation delay b to a 5 7 2 5 2 4 2 4 ns t plh low to high propagation delay b to a 4 7 2.5 5 2 4 1 3 ns t pzl off-state to low propagation delay oe to a 6 14 4 8 4 8 3 5 ns oe to b 10 15 5 8 4 7 4 5 ns t plz low to off-state propagation delay oe to a 100 120 100 120 100 120 100 120 ns oe to b 100 120 100 120 100 120 100 120 ns t sk(o) output skew time between channels [2] -1-1-1-1ns f data data rate - 18 - 32 - 40 - 52 mbps table 10. dynamic characteristics for temperature range ? 40 ? c to +85 ?c [1] voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 ; for wave forms see figure 5 and figure 6 . symbol parameter conditions v cc(b) unit 1.8 v ? 0.15 v 2.5 v ? 0.2 v 3.3 v ? 0.3 v 5.0 v ? 0.5 v typ max typ max typ max typ max measurement points are given in table 11 . v ol and v oh are typical output voltage levels that occur with the output load. fig 5. the data input (an, bn) to data output (bn, an) propagation delay times & ' !()* ()* + , -./ ./ , . & ' ' / -/. /.
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 9 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing [1] v cci is the supply voltage associated with the input. [2] v cco is the supply voltage associated with the output. measurement points are given in table 11 . v ol and v oh are typical output voltage levels that occur with the output load. fig 6. enable and disable times -/0 '' 1#$ ,
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' -0/ 5 6 '' $1#$ '' 1#$ table 11. measurement points [1] [2] supply voltage input output v cco v m v m v x v y 1.65 v to 5.5 v 0.5v cci 0.5v cco 0.5v cco 0.1v cco
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 10 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing [1] v cci is the supply voltage associated with the input. test data is given in table 12 . all input pulses are supplied by generators having the following characteristics: prr ? 10 mhz; z o = 50 ? ; dv/dt ? 1.0 v/ns. r l = load resistance. c l = load capacitance including jig and probe capacitance. v cc0 = supply voltage associated with the output. fig 7. test circuit for measuring switching times , , 2 2 () 7() ( + + 8 '# '# ( , , 7() () * * + 9 / : / table 12. test data supply voltage input load v cc(a) v cc(b) v i [1] t r /t f c l r l 1.65 v to 1.95 v 1.65 v to 1.95 v v cci ? 2.0ns 50pf 2.2k ? 2.3 v to 2.7 v 2.3 v to 2.7 v v cci ? 2.0ns 50pf 2.2k ? 3.0 v to 3.6 v 3.0 v to 3.6 v v cci ? 2.5ns 50pf 2.2k ? 4.5 v to 5.5 v 4.5 v to 5.5 v v cci ? 2.5ns 50pf 2.2k ?
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 11 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 14. application information 14.1 applications the ntsx2102 can be used in point-to-point applications to interface between devices or systems operating at different supply vo ltages. the device is targeted at i 2 c or 1-wire buses which use open-drain drivers. 14.2 architecture the architecture of the ntsx2102 is shown in figure 9 . the device does not require an extra input signal to control the direction of data flow from a to b or b to a. the ntsx2102 is a "switch" type voltage translator, it employs two key circuits to enable voltage translation: 1. two pass-gate transistors (n-channel) that tie the ports together. 2. an output edge-rate accele rator that detects and accele rates rising and falling edges on the i/o pins (see figure 10 ). fig 8. typical voltage le vel-translation circuit ; <6<
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ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 12 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing during an input transition, a one-shot accelerate s the output transition by switching on the pmos transistors (t1, t3) for a low-to-high transition. alternatively, it switches on the nmos transistors (t2, t4) for a high-to-low tr ansition. once activated, the one-shot is de-activated after approximately 25 ns (see figure 11 ). during the acce leration time, the driver output resistance is between approximately 10 ? and 35 ? . to avoid signal contention, the application must not exceed the maximum data rate or wait for the one-shot circuit to turn-off, before appl ying a signal in the opposite direction. v cc(a) = 3.3 v; v cc(b) = 3.3 v. fig 10. input and output waveforms showing edge-rate acceleration fig 11. one-shot pulse time versus v cco ( (( ( ( ( ( ( + ( ( ( ( ( 3@ " (
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 13 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 14.3 input driver requirements as the ntsx2102 is a switch type translator, pr operties of the input driver directly affect the output signal. the external open-drain dr iver applied to an i/o, determines the static current sinking capability of the system. the maximum data ra te, output tr ansition times (t thl , t tlh ) and propagation delays (t phl , t plh ) are dependent upon the output impedance and edge-rate of the external driver. 14.4 output load considerations the maximum lumped capacitive load that can be driven is dependent upon the one-shot pulse duration and has been tuned to 600 pf. in cases with higher capacitive loading, there is a risk that the output does not reach the positive rail within the one-shot pulse duration. to avoid excessive capacitive loading and to ensure correct triggering of the one-shot, use short trace lengths and low capacitance connectors on ntsx2102 pcb layouts. the length of the pcb trace should be such that the round-trip delay of any reflection is within the one-shot pulse durat ion. such a length ensures low impedance termination and avoids outp ut signal oscillations a nd one-shot retriggering. 14.5 output enable (oe) an output enable input (oe) is used to dis able the device. setting oe = low causes all i/os to assume the high-impedance off-state. 14.6 power-up when either of the supplies v cc(n) is at 0 v, outputs are in the high-impedance off-state. one of the advantages of ntsx translators is that either v cc(a) or v cc(b) may be powered up first. to reduce dissipation during power-up, en sure that output enable (oe) is defined. connect it via a pull down resistor to gnd or , if the application a llows, hardwired to v cc(a) . if the oe pin is hardwired to v cc(a) , either supply can be powered up or down first. if a pull down is used, the following sequences are recommended. for power-up: 1. apply power to either supply pin 2. apply power to other supply pin 3. enable the device by driving oe high for power down: 1. disable the device by driving oe low 2. remove power from either supply pin 3. remove power from other supply pin 14.7 pull-up resistors on i/o lines each a port i/o requires a pull-up resistor to v cc(a) , and each b port i/o requires a pull-up resistor to v cc(b) . choose the magnitude of the pull-up resistors to ensure that the output voltage levels meet the application requirement.
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 14 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 15. package outline fig 12. package outline sot902-2 (xqfn8) references outline version european projection issue date iec jedec jeita sot902-2 - - - mo-255 - - - sot902-2_po 10-11-02 11-03-31 unit (1) mm max nom min 0.5 0.05 0.00 1.65 1.60 1.55 1.65 1.60 1.55 0.55 0.5 0.15 0.10 0.05 0.1 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. xqfn8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm sot902-2 a 1 b 0.25 0.20 0.15 deee 1 l 0.35 0.30 0.25 l 1 vw 0.05 yy 1 0.05 0 1 2 mm scale terminal 1 index area b a d e x c y c y 1 terminal 1 index area 3 l l 1 b e 1 e ac b v c w 2 1 5 6 7 metal area not for soldering 8 4 a 1 a detail x
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 15 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing fig 13. package outline sot1309-1 (xqfn8) references outline version european projection issue date iec jedec jeita sot1309-1 mo-255 sot1309-1_po 11-08-18 11-08-23 unit mm max nom min 0.50 0.025 0.00 0.25 1.45 1.25 0.30 0.40 0.05 a dimensions note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included xqfn8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.4 x 1.2 x 0.5 mm sot1309-1 a 1 a 3 bdeee 1 0.8 l l 1 v 0.10 wy 0.05 y 1 0.20 1.40 1.20 0.4 0.127 0.05 0.25 0.35 0.15 1.35 1.15 0.35 0.45 0 3 mm scale detail x e 1 x ac b v wc d e a 3 a 1 a b terminal 1 index area terminal 1 index area a c y c y 1 l 1 l b b e 4 6 8 5 2 1
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 16 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing fig 14. package outline sot996-2 (xson8) references outline version european projection issue date iec jedec jeita sot996-2 sot996-2_po 07-12-21 12-11-20 unit (1) mm max nom min 0.5 0.05 0.00 2.1 1.9 3.1 2.9 0.5 0.3 0.15 0.05 0.6 0.4 0.5 1.5 0.05 a dimensions (mm are the original dimensions) xson8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm sot996-2 a 1 b 0.35 0.15 deee 1 ll 1 l 2 v 0.1 wy 0.05 y 1 0.1 0 1 2 mm scale c y c y 1 x terminal 1 index area b a d e detail x a a 1 b 14 85 e 1 e ac b v c w l 2 l 1 l
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 17 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 16. abbreviations 17. revision history table 13. abbreviations acronym description cdm charged device model cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge gpio general purpose input output hbm human body model i 2 c inter-integrated circuit pcb printed circuit board pmos positive metal oxide semiconductor smbus system management bus uart universal asynchronous receiver transmitter utlp ultra thin leadless package table 14. revision history document id release date data sheet status change notice supersedes ntsx2102 v.2 20130211 product data sheet - ntsx2102 v.1.1 modifications: ? for type number ntsx2102gd xson8u has changed to xson8. ntsx2102 v.1.1 20121121 product data sheet - ntsx2102 v.1 modifications: ? section 1 ? general description ? text updated. ntsx2102 v.1 20121119 product data sheet - -
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 18 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 18.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 18.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
ntsx2102 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 2 ? 11 february 2013 19 of 20 nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 18.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 19. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors ntsx2102 dual supply translating transceiver; op en drain; auto direction sensing ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 11 february 2013 document identifier: ntsx2102 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 20. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 functional description . . . . . . . . . . . . . . . . . . . 4 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 recommended operating conditions. . . . . . . . 4 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 6 13 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 application information. . . . . . . . . . . . . . . . . . 11 14.1 applications . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14.2 architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14.3 input driver requirements . . . . . . . . . . . . . . . . 13 14.4 output load considerations . . . . . . . . . . . . . . . 13 14.5 output enable (oe) . . . . . . . . . . . . . . . . . . . . 13 14.6 power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14.7 pull-up resistors on i/o lines. . . . . . . . . . . . . . 13 15 package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 16 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 18 legal information. . . . . . . . . . . . . . . . . . . . . . . 18 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 18.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 18.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 19 contact information. . . . . . . . . . . . . . . . . . . . . 19 20 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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